Wafer Vision Inspection Handler:
Wi8i G2
Benefits
Robust Inspection Algorithm
- Dynamic Inspection Region Selection
- Flexible Dimension Measurement
- Configurable Defects Categorization
- Customizable E-Map Generation
- Raw & Mounted Wafer Loading
- SECS/GEM Ready
- Data Collection Charting
- Yield Optimization by Offline Verifier
- Color Inspection
Sophisticated Hardware Design
- Imaging by 25 Megapixels High-Resolution Camera
- Automated & Fast Conversion within 3 Magnification Lenses
- Raw Wafer Warpage Handling
- Bernoulli Dual Arm Raw Wafer Robot
- Intelligent Autofocus Technology
- Customized LED Lighting
- Bottom Vision Inspection
Inspection Criteria
Specification
| Model Type | Wi8i G2 | ||
| Wafer Input Type & Size |
Raw Wafer : 6*(150mm), 8*(200mm), 12*(300mm) Hoop Ring : 4*(100mm), 6*(150mm), 8*(200mm) – manual loading Framed Wafer: 6*(150mm), 8*(200mm), 12*(300mm) |
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| Camera Lens | 2X | 5X | 7.5X |
| Accuracy | 2.2μm/ pixel | 0.9μm/ pixel | 0.6μm/ pixel |
| Field of view | 9.1mm x 9.1mm | 3.6mm x 3.6mm | 2.4mm x 2.4mm |
| System Capability |
Offline Verifier Wafer Automated Loader-Unloader |
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